Workshop on "Recent advances on the mechanical and electrical properties of thin films"
“Little is known on the electrical and mechanical response of thin metallic films when their microstructural features (film thickness, surface roughness, grain sizes…) reach nanometric dimensions. Indeed the fundamental mechanisms of charge transport as well as their mechanical properties and response under internal and/or external solicitations are not predictable by the current models available in the literature”.
The objective of the workshop is presenting and discussing results of electrical and mechanical experiments in thin films developed by researchers in Chile (Laboratorio de superficies, DFI-Uchile) and France (Simap-TIMA-Grenoble INP). The workshop will be divided in two sessions: one for oral presentations and a discussion panel aimed at stablishing colaborations about topics of common interest.
The wokshop will be held at the FCFM of University of Chile in Santiago on the 16th of november of 2009.
The objective of the workshop is presenting and discussing results of electrical and mechanical experiments in thin films developed by researchers in Chile (Laboratorio de superficies, DFI-Uchile) and France (Simap-TIMA-Grenoble INP). The workshop will be divided in two sessions: one for oral presentations and a discussion panel aimed at stablishing colaborations about topics of common interest.
The wokshop will be held at the FCFM of University of Chile in Santiago on the 16th of november of 2009.
(Left) Schematic representation of the micro tensile testing device. The term “Jack” indicates the elements that will transfer the displacements induced by the rotation of the associate endless screw. (Center) Schematic representation of sample installation and test preparation. (Right) Top view of sample with welded connections for resistivity determination.